Institute of Multidisciplinary Research for Advanced Materials (IMRAM),
Tohoku University, Japan
Dr. Ashiqur Rahman was born in Chittagong, Bangladesh, in 1980.Currently he is working as an Assistant Professor at Institute of Multidisciplinary Research for Advanced Materials (IMRAM), Tohoku University, Japan. He received his BSc and MSc degrees in Applied Physics, Electronics and Communication Engineering from the University of Dhaka, Bangladesh, in 2004 and 2006 respectively. He received the Ph.D. degree in Space science from Universiti Kebangsaan Malaysia, Malaysia, in 2017. From 2006 to 2010, he was a Microwave Engineer at Siemens Bangladesh Ltd. He worked for Nokia Siemens Networks as a Project Quality Manager from 2010 to 2013, before he left to pursue his PhD degree. He has been a Graduate research assistant with department of Electrical, Electronic and System Engineering of the Universiti Kebangsaan Malaysia (UKM). So far, he is the author of 15 research articles and 2 patents. His research interests include flexible, stretchable and transparent antenna design, microwave imaging, material dielectric characterization and electromagnetic performance analysis.
Title: Fabrication of Flexible Electronics: From Flexible and Transparent Display to Wearable Sensor by Direct Laser Writing
The potentiality of the current microelectronics and nanoelectronics in our daily life, expanded from the wireless communication to the biomedical science.Flexible electronics earn immense interest from both academia and industry in recent years owing to their unique characteristics of light weight, easy to fabricate, low manufacturing cost and availability of the inexpensive flexible materials. According to the IDTechEx analysts forecast,the total market for printed, flexible and organic electronics will grow from $31.7 billion in 2018 to $77.3 billion in 2029.The processes and materials for manufacturing flexible electronics differ, but the aim is to make them lower cost than conventional electronics. Roll to roll printing has been long considered the ultimate approach to the cost-effective manufacture of electronics over large and small areas. Faster and cheaper processing technologies are required to reduce the production cost with increasing demand of printing electronics. In contrast time consuming oven post treatment steps, curing of conductive inks and soldering of components can be done within a fraction of second by means of high intense light pulse.This short processing time allows for high volume, cost effective and energy efficient production of printed electronics in a roll-to-roll manner. In recent years printed electronics industry withnessed several impressive technological breaktrough, effectively paving the way towards a wide range of novel processing methods and application. Current production technologies are still heavily relying on traditional approaches for deposition and post deposition treatment. This dependence on techniques like inkjet or screen printing and thermal oven curing results in a number of serious limitations for the resolution and accuracy of functional patterns as well as for a reliable device production on industrial scale. Innovative approaches for processing based on light, such as laser and photonic flash sintering, have already demonstrated their high potential to supplement the printed electronics industry’s tool box. At the same time, flexible electronics need to be compatible with flexible antenna in particular
frequency bands constantly to provide wireless connectivity according to the requirement of the application.
In this conference, I will present the fabrication of flexible and transparent hybrid ITO by direct laser writing for flexible display and antenna sensor.